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This BGA arrangement template is for professional cell phone repair use. It is use for BGA clip ball solder. Help you to save your materials in the cell phone repair process.
Description: - This is a Cell Phone Repair Tool for professional
- This BGA Arrangement Template used for solder BGA clip balls/ Cell phone IC/ Cell phone CPU
- Made of high quality stainless steel sheet materials
- The small grids are molded by laser, durable and not easy to distort when be heated
- This BGA Clip Ball Solder Template contains many types of cell phone’s BGA clip ball template, such as Motorola V3/V3i flash, Motorola V3x flash, Siements C55 flash, Nokia 7650 MF, Motorola V66 flash, Samsung V208 IC, Nokia 3510 CPU, Nokia 8810 CPU, ect
- This IC Solder Template will help you to save your material in the repair process
- Only suitable for professional use, the solder work is not easy, please make sure that you can do it by yourself before your purchase
- Thickness: 0.25mm
- Total size: about 245 x 95 x 0.25mm (L x W x H)
- Weight: 28g
This product was added to our catalog on Monday 14 July, 2008.
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